邦定(COB)

COB流程:

Die Attach(粘晶片) --> Wire Bonding(壓焊) --> Function Test (功能測試) --> Epoxy coating & Curing(封膠) --> Visual Inspection (外觀檢查) --> Function Test(功能測試) --> Packing(包裝)

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贴片(SMT)

SMT流程:

Solder Paste Print(全自動錫漿絲印) --> Appearance Check for Solder Paste(錫漿外觀檢查) --> SMD(貼片) --> Appearance Check for Parts(貼片後外觀檢查) --> Process Reflow Soldering (過回流焊) -->Appearance Check (AOI) (外觀檢查) --> Electrical Test (功能测试) --> Packing(包裝)

点这里查看详细流程图>>

焊锡(PCBA)

PCBA流程:

Parts forming(零件成形) --> Parts insertion(零件插入) --> Visual Inspection(外觀檢查) --> Wave Soldering(過波峰爐粘錫) --> ICT Test /(开、短路测试) --> Visual Inspection /(外觀檢查) --> Final Test ( 功能測試) --> Packing ( 包裝)

点这里查看详细流程图>>